Intel plans to cut the fat from its RealSense 3D camera so that it can fit the device on a smartphone.The company’s CEO Brian Krzanich showed off Wednesday in Shenzhen, China a 6-inch prototype phone built with the new camera, which is about half the size of the older version. The company plans to start deploying the technology this year.
The U.S. chipmaker has been wanting to bring RealSense to PCs and tablets, but with the smaller size it can also deliver it to smartphones, Krzanich said. Devices built with the 3D camera could offer gesture control like Microsoft’s Kinect device.Intel wants to tap into Shenzhen’s hardware eco-system, but it faces an uphill battle. Many Chinese vendors have long been using ARM-based chips from Intel’s rivals Qualcomm and MediaTek. These chips are generally more power-efficient and cost less than Intel processors.